Transversely interconnected strands bundled together in configurations which are application specific for each appliance and data/output set characteristics...
along these strands are deposited various types of distributed blobular-resinous micro-chips with "intra-nanostrand design" as well as power regulation/storage pellets...
together the entire mesh of strands makes up an appliance with lower internal resistance, completely customized interconnects, data-buss, instruction-set, address-buss, memory, and cpu transmissions single-strand-multiplexed into a fully form-distributed mesh-media interconnect which is optimized for the task....
so for example - some bundles would have a few strands with a minimum set of distributed computer chips along them - in these simple bundle computers there would be very little need for proximal transverse connections so collateral connections at each end of each strand would facilitate most strand to strand information exchanges - all the distributed chips work synergistically so this is very important once many strands are bundled together...
the resinous micro-chips could be rather large for simple systems which are primarily stationary...
as the necessity for lower power and mobility become more important the strands become thinner and the distributed chips become smaller and more dispersed...
interconnections get complicated with a mixture of proximal(somewhere mid-strand) & collateral(from the ends of the strands) transverse(to other major sub-system)/parrallel(within the same major sub-system) interconnects...
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